InvenSense Announces Addition Of Two New Members To Its Board Of Directors

SAN JOSE, California, October 27, 2014 ­ InvenSense, Inc. (NYSE:INVN), the leading provider of intelligent sensor solutions, announced the appointment of Intel executive Amir Faintuch and Tomon Partner’s Emiko Higashi to its Board of Directors, expanding the Board to eight members.

“Both Emiko and Amir bring significant experience leading fast­growth companies in competitive global markets with long term success,” said Behrooz Abdi, president and chief executive officer of InvenSense. “We are extremely pleased to welcome two new members of this caliber. Both will assist in rapidly scaling and building InvenSense as we continue to leverage our leadership position and execute on our innovative System on Chip (SoC) technologies in the expanding Internet of Things landscape.”

Faintuch currently serves as the corporate senior vice president and general manager of the Platform Engineering Group at Intel Corporation. In this role, he leads numerous worldwide engineering teams that are responsible for the IP design, system­on­chip (SoC) development, manufacturing and validation of the company’s overall chip portfolio across Intel businesses.

Faintuch previously served as president, senior vice president and general manager of Qualcomm Atheros, where he helped establish Qualcomm’s position in wireless connectivity and location technologies targeting the mobile, computing and consumer electronics businesses. He also successfully managed the integration of Atheros’ and Qualcomm’s respective mobile connectivity teams, products and technologies following the 2011 Atheros acquisition. Faintuch holds dual master’s degrees in management with an emphasis in high technology from Northwestern University’s Kellogg School of Management and Tel­Aviv University’s Recanati School of Management. Faintuch also holds Bachelor of Science degrees in economics and business management from Haifa University in Israel.

Higashi is founder and Managing Partner of Tomon Partners, LLC, a mergers and acquisitions and strategy consulting firm. Prior to Tomon Partners, she was a co­founder and chief executive officer of the technology­focused venture capital firm, Gilo Ventures. Higashi previously spent 15 years in investment banking. After beginning her investment banking career at Lehman Brothers, Higashi was a founding member of Wasserstein Parella and the head of that firm’s technology M&A business from 1988 to 1994, and subsequently served as a managing director in charge of Merrill Lynch’s global technology M&A practice Higashi also spent two years as a consultant at McKinsey & Co. in Tokyo, Japan. Higashi received a Bachelor of Arts from International Christian University in Japan and a Master’s in Business Administration from Harvard Business School.

For further information about InvenSense, please visit our website at or contact InvenSense Investor Relations at

About InvenSense

InvenSense Inc. (NYSE:INVN) is the world’s leading provider of intelligent sensor solutions for consumer electronic devices. The company’s patented InvenSense Fabrication Platform and patent­pending MotionFusion(TM) technology address the emerging needs of many mass­market consumer applications via improved performance, accuracy, and intuitive motion­, gesture­ and sound­based interfaces. InvenSense technology can be found in consumer electronic products including smartphones, tablets, wearables, gaming devices, optical image stabilization, and remote controls for Smart TVs. The company’s MotionTracking products are also being integrated into a number of industrial applications. InvenSense is headquartered in San Jose, California and has offices in Canada, China, France, Korea, Japan, Slovakia, Taiwan, and Boston, MA. More information can be found at or follow us on Twitter at @InvenSense.

©2014 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, DMP, AAR, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be trademarks of the respective companies with which they are associated.

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